299 Research Engineer jobs in Malaysia

Job Responsibilities:

• Develop and sustain Dry etch processes in R&D and Small volume manufacturing environment.
• Responsible for performing professional process engineering research, from the concept to the final process development for a wide variety of materials. (Metals, Silicon, Dielectrics, SiC and other speciality materials)
• May conceive and plan projects involving the definition and selection of new materials, concepts and approaches in the processing or developing of new processes.
• Compiles and evaluates test data to determine appropriate limits and variables for process specifications.
• Championing engineering experiments for process characterization to drive quality and yield improvement.
• Set up and collect the experimental data and generate reports for internal and customer distribution.
• Design and complete DOE (Design of Experiments) evaluations to characterize process window for new requirements.
• Work closely with senior staff and process integrators to understand technology roadmaps, process capability requirements and business issues/ challenges.
• Act as a resource for colleagues with less experience; lead small projects with manageable risks.
• Act as subject matter expert for both internal and external stakeholders.

Requirements:

• Bachelor or Masters in Materials Science, Metallurgy, Electrical, Electronics, Chemical Engineering, Chemistry or Physics; or relevant field science and engineering fields.
• At least 5 years of experience in plasma or semiconductor process exposure are added advantages.
• Prior experience in dry etch/Wet etch processes is preferred.
• Knowledge of plasma fundamentals is an added advantage.
• Hands-on experience in designing and executing experiments (DOE), statistical and cause analysis, and problem-solving methods.
• Possess good interpersonal and communication skills.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.

Interested applicants are invited to apply directly at the NUS Career Portal

Your application will be processed only if you apply via NUS Career Portal

We regret that only shortlisted candidates will be notified.

This research project involves the development of a versatile and high-performance robotic nursing platform for smart hospital systems. The research fellow is expected to contribute to the following aspects:
a) Designing a multifunctional and capable robotic nursing platform with an emphasis on patient caregiving and clinical logistics. The goal is to reduce the workload of human nurses, enabling them to focus on more complex and critical tasks.
b) Developing a robust and versatile control system for the proposed platform, leveraging foundation models or reinforcement learning to support functions such as interactive navigation and intelligent human–robot interaction.
c) Deploying and evaluating the developed robotic nursing platform in a real hospital environment to assess its effectiveness and practical impact.

• Min Bachelor’s degree in a relevant discipline, such as robotics, mechanical engineering, electrical/electronic engineering, computer science, or related fields.
• Solid experience in robotic control, particularly in reinforcement learning, imitation learning and foundation models. Publications in the robotics domain is a plus.
• Proficiency in advanced perception models.
• Hands-on experience in real-world robotics deployment and addressing the sim-to-real gap.
• Solid knowledge of numerical methods, including optimization, linear algebra, and geometry processing.
• Software programming in C/C++ and Python.
• Excellent analytical and computational skills.
• Understanding of software engineering principles, preferred worked experience on open-source software.
• The candidate must have the ability to work independently as well as part of a team with strong initiatives and have the curiosity to explore the unknown.
• Open to Fixed Term Contract.

The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Research Engineer or Senior Research Engineer to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterization. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.

Key Responsibilities

• Support R&D in advanced semiconductor packaging processes, including flip-chip, hybrid bonding, and related integration techniques.
• Interposer and Hybrid Bond pad fabrication for Flip Chip and Hybrid bonding applications
• Optimize Chip to wafer hybrid bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
• Conduct engineering experiments for process characterization to drive quality and yield improvements.
• Perform reliability characterization of flip-chip or hybrid-bonded packages to ensure robustness and long-term performance.
• Lead capability development projects with manageable risks and mentor less experienced colleagues.
• Collaborate with senior staff and principal investigators to develop process capability and new.
• Inspire and mentor talents in semiconductor technology, contributing to workforce development in the field.

Qualifications and Skills

Candidates should meet the following criteria:

• Educational Background: Bachelors in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
• Experience: 1 to 6 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogenous integration applications.
• Technical Expertise: Hands-on experience in flip chip bonding is preferable
• Knowledge: Knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterization is preferable, but not mandatory.
• Skills: Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments.
• Excellent written and verbal communication abilities.
• Teamwork: Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.
• Heterogeneous integration and advanced packaging is preferred, but candidates with relevant semiconductor process or packaging experience are welcome to apply.

What We Offer

• The opportunity to work on cutting-edge research in advanced packaging and heterogeneous integration.
• A collaborative and interdisciplinary work environment.
• Access to state-of-the-art facilities and resources.
• Join us in shaping the future of semiconductor technologies and heterogeneous integration. Apply today!

Interested applicants are invited to apply directly at the NUS Career Portal

Your application will be processed only if you apply via NUS Career Portal

We regret that only shortlisted candidates will be notified.

Positions are available for Research Engineers, Research Assistants, and Ph.D. students in the research group of Dr. Soh Siow Ling, at the Department of Chemical and Biomolecular Engineering, National University of Singapore (NUS).

The research of the group is highly interdisciplinary and involves electrostatics, interfacial charge separation, dynamics, and soft functional matter (e.g., functional polymers). The research typically involves a combination of engineering, materials science, chemistry, and physics.

A major research area of focus is the separation of charge at interfaces of matter, including solid, liquid, and gas. Phenomena related to interfacial charge separation are very poorly understood; hence, there are tremendous opportunities for fundamental discoveries and development of novel applications. In particular, one project in the group involves using electrostatics for clearing atmospheric aerosols and preventing the spread of infectious diseases (e.g., COVID-19). Another project involves the development of a unique system from the group for harvesting water energy from nature and generating electricity. Another research area involves functional polymers and stimuli-responsive systems for developing intelligence in materials.

The general approach of the group is to engage in unique fields of research and original technologies. It aims to publish highly novel and impactful research works. Projects in the group usually involve strong fundamentals, including discovery and understanding natural phenomena. Based on the fundamental science studied by the group, a wide range of applications are being developed; examples include dynamics of atmospheric aerosols, clean energy, sustainability (e.g., recycling), surfaces with superior properties (e.g., antistatic surfaces), molecular separation, drug delivery, and soft machines.

The ideal candidate is preferably someone open-minded to unique fields of research, independent, and hardworking. Because the research of the group is highly interdisciplinary, candidates from a wide range of backgrounds will be considered, including engineering (e.g., chemical, mechanical, etc), materials science, chemistry, and physics.

If interested, please apply via the NUS Career portal.

For more information on the background of the research, please refer to: