120 Packaging Engineer jobs in Malaysia

Job Description

Change the world. Love your job.
Interface across various work areas and organizations to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power. In this role you'll get the opportunity to thrive in a fast paced, dynamic environment where high-energy, prioritization skills and adaptability are a must!

Packaging engineers play an important role at TI which encompasses the following responsibilities:

• Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
• Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
• Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
• Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.

As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry's top engineering minds at your disposal. TI's corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy.

Put your talent to work with us as a Packaging Engineer !

Qualifications

• Bachelor's degree in Mechanical Engineering, Mechatronic Engineering, Physics, Software Engineering, Computer Science and other relevant backgrounds
• Cumulative 3.0/4.0 GPA, or higher
• Fresh graduates to less than 2 years of relevant working experiences

Preferred Qualifications:

• Basic understanding of statistical process control (SPC)
• Semiconductor packaging knowledge is preferred (manufacturing processes, assembly, reliability, materials, characterization, FA)
• Proficient in AutoCAD and SolidWorks
• Skilled in programming language such as Phyton is preferred
• Exposure to AI/ML will be added advantage
• Demonstrated analytical and problem-solving skills
• Strong written and verbal communication skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for results

Texas Instruments will not sponsor job applicants for visas or work authorization for this position.

About Us

Why TI?

• Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
• We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.Meet the people of TI
• Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.

About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more atTI.com .

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.

If you are interested in this position, please apply to this requisition.

TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.

Job Info

• Job Identification 25000761
• Job Category Engineering - Product Dev
• Posting Date 08/21/2025, 01:47 AM
• Apply Before 08/30/2025, 04:00 PM
• Degree Level Bachelor's Degree
• Locations MELA Batu Berendam Free Trade Zone, Melaka, 75350, MY
• ECL/GTC Required Yes

Texas Instruments is an equal opportunity employer. Click here to learn more and for information on accessibility and your rights as an applicant.

If you have an inquiry about opportunities to partner with TI to support workforce development, email

#J-18808-Ljbffr

Job Responsibilities:

• Collaborate with sales & marketing to review, identify, reply, propose, introduce, qualify, and meet customer-specific packaging requirements to maintain current and win new business.
• Provide plant-wide packaging engineering support to establish, update, maintain, streamline, and implement packaging standards, specifications, and changes through proper documentation and database updates.
• Sourcing and qualifying packaging materials with proper documentation.
• Support packaging labeling updates, maintenance, and implementation through proper documentation and database updates.
• Collect information from multiple sources—sales & marketing, product engineering, miniPIP, or customers—to review, identify, and define product packaging requirements.
• Review, respond to, and ensure compliance with customer-specific packaging inquiries, industrial packaging specifications, and environmental packaging requirements. Identify, qualify, introduce, obtain approval for, and implement new packaging solutions that induce cost savings.
• Work with suppliers, purchasers, and tooling/engineering teams on sourcing, qualifying, and designing new packaging materials through proper documentation such as ECO & MCO.
• Create, update, maintain, and implement packaging information and changes through proper documentation in the Agile Packaging Matrix, Pack WI, and Label Pack WI.
• Collaborate with PEs to maintain BOM accuracy related to packaging materials. Identify, improve, and streamline packaging processes to enhance packaging line robustness.
• Establish, update, and maintain packaging information in the Camstar database to enable automatic packaging label printing.
• Conduct shipping label peer reviews and control the timing and implementation of packaging labels to execute FA shipments effectively and meet OTD. Support SNY packaging upon request.
• Perform other duties as directed by the immediate supervisor.
• Ensure compliance with safety, ESD, cleanroom, and housekeeping guidelines.
• Practice continual improvement, risk-based thinking in planning and execution, and ensure compliance with ISO requirements, company rules, regulations, and applicable codes.

Job Requirements:

• Bachelor's Degree in Science or Engineering, preferably in Mechatronics or Mechanical.
• Experience in managing incoming, in-process, and outgoing quality-related matters.
• Good computer literacy and basic SPC knowledge.
• Strong analytical skills with a hands-on working attitude.
• Adaptable and flexible to rapid business changes.
• Experience in high-mix, high-volume manufacturing, assembly, SMT, or PCBA environments is advantageous.
• Knowledge of mechanical dimensioning & tolerancing analysis and poka-yoke principles is an advantage.
• Fluency in Mandarin is an added advantage.

Working Conditions:

• This role can be 100% onsite, hybrid, or remote.

Culture Commitment:

Adhere to the company's values (ICARE):
Integrity: Create an environment of trust.
Collaboration: Innovate through sharing ideas.
Accountability: Own the process and outcomes.
Respect: Recognize the value in everyone.
Enthusiasm: Find purpose in work.

Coherent Corp. is an equal opportunity employer. All qualified applicants will receive consideration without regard to sex, gender identity, sexual orientation, race, religion, disability, veteran status, age, or other protected characteristics.

About Us:

Coherent is a global leader in lasers, engineered materials, and networking components, developing innovative products for diverse applications including industrial, optical communications, military, life sciences, semiconductor equipment, and consumer markets. We offer a comprehensive career development environment that challenges employees and rewards excellence. Join us for stability, longevity, and growth opportunities.

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The primary mission for the Engineer II, Packaging is to assist in the development and analysis of packaging/labeling products and materials. Under direct supervision/guidance, compiles, analyzes, and reports operational, test, and research data to establish performance standards for newly designed or modified products, processes, or materials for packaging/labelling.

Job Responsibilities:

This individual will be responsible for the design and coordination of packaging activities for New Products and Sustaining Operations.

This includes product package design, product labels, DFUs (Directions for Use), and packaging specifications.

Creation, change, and control of all labeling and packaging components to support R&D in the plant.

Ensure all labeling and packaging components meet performance and healthcare standards, including conformance to all country-specific requirements.

Liaise with vendors on specifications for package and label components.

Communicate to teams and management on the progress of labeling and packaging projects.

Liaise with sister divisions to ensure a consistent approach to labeling and packaging.

Coordinate with various departments within BSC on packaging-related projects.

Build quality into all aspects of work by maintaining compliance with all quality requirements.

Liaise with various translation companies for the translation of text used in all labeling and packaging components.

Job Requirements:

Bachelor's degree in Engineering, Science, or Technology is required.

At least 3 to 5 years of experience in a similar role.

Project management experience is strongly preferred.

Exceptional communication, facilitation, interpersonal, and relationship-building skills.

Ability to clearly communicate complex information across multiple functions, create buy-in from team members, and negotiate disagreements productively.

Strong knowledge of package and label components.

Extremely detail-oriented.

About Us:

As a global medical technology leader for more than 40 years, our mission at Boston Scientific (NYSE: BSX) is to transform lives through innovative medical solutions that improve patient health. If you’re looking to truly make a difference to people around the world and nearby, there’s no better place to do it.

Job Segment: Package Design, Project Manager, Engineer, Medical Technology, Manufacturing, Technology, Engineering, Research, Healthcare

#J-18808-Ljbffr

Purpose Statements

The primary mission for the Engineer II, Packaging is to assist in the development and analysis of packaging/labeling products and materials. Under direct supervision/guidance, compiles, analyzes, and reports operational, test, and research data to establish performance standards for newly designed or modified products, processes, or materials for packaging/labeling.

Job Responsibilities

1. This individual will be responsible for the design and coordination of packaging activities for New Products and Sustaining Operations.
2. This will include product package design, product labels, DFUs (Directions for Use), packaging specifications.
3. Creation, change, and control of all labeling and packaging components to support R&D in the plant.
4. Ensure all labeling and packaging components meet performance and healthcare standards, including conformance to all country-specific requirements.
5. Liaise with vendors on specifications for package and label components.
6. Communicate to teams and management on the progress of labeling and packaging projects.
7. Liaise with sister divisions to ensure a consistent approach to labeling and packaging.
8. Communicate with various departments within BSC on packaging-related projects.
9. Build quality into all aspects of work by maintaining compliance with all quality requirements.
10. Liaise with various translation companies for the translation of text used in all labeling and packaging components.

Job Requirements

1. Candidate requires at least a bachelor's degree in Engineering, Science, or Technology.
2. At least 3 to 5 years’ experience in a similar role.
3. Project management experience is strongly preferred.
4. Exceptional communication, facilitation, interpersonal, and relationship-building skills.
5. Ability to clearly communicate complex information across multiple functions, create buy-in from team members, and negotiate disagreements productively.
6. Strong knowledge of package and label components.
7. Extremely detail-oriented.

About Us

As a global medical technology leader for more than 40 years, our mission at Boston Scientific (NYSE: BSX) is to transform lives through innovative medical solutions that improve the health of patients. If you’re looking to truly make a difference to people both around the world and around the corner, there’s no better place to make it happen.

#J-18808-Ljbffr

**Change the world. Love your job.**
Interface across various work areas and organizations to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power. In this role you'll get the opportunity to thrive in a fast paced, dynamic environment where high-energy, prioritization skills and adaptability are a must!
Packaging engineers play an important role at TI which encompasses the following responsibilities:
+ Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
+ Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
+ Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
+ Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.
As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry's top engineering minds at your disposal. TI's corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy.
Put your talent to work with us as a Packaging Engineer !
**Why TI?**
+ Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
+ We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI ( Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
**About Texas Instruments**
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com .
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
If you are interested in this position, please apply to this requisition.
**Minimum Requirements:**
+ Bachelor's degree in Mechanical Engineering, Mechatronic Engineering, Physics, Software Engineering, Computer Science and other relevant backgrounds
+ Cumulative 3.0/4.0 GPA, or higher
+ Fresh graduates to less than 2 years of relevant working experiences
**Preferred Qualifications:**
+ Basic understanding of statistical process control (SPC)
+ Semiconductor packaging knowledge is preferred (manufacturing processes, assembly, reliability, materials, characterization, FA)
+ Proficient in AutoCAD and SolidWorks
+ Skilled in programming language such as Phyton is preferred
+ Exposure to AI/ML will be added advantage
+ Demonstrated analytical and problem-solving skills
+ Strong written and verbal communication skills
+ Ability to work in teams and collaborate effectively with people in different functions
+ Strong time management skills that enable on-time project delivery
+ Ability to build strong, influential relationships
+ Ability to work effectively in a fast-paced and rapidly changing environment
+ Ability to take the initiative and drive for results
Texas Instruments will not sponsor job applicants for visas or work authorization for this position.
**ECL/GTC Required:** Yes

Purpose Statements

The primary mission for the Engineer II, Packaging is to assist in the development and analysis of packaging/labeling products and materials. Under direct supervision/guidance, compiles, analyzes, and reports operational, test, and research data to establish performance standards for newly designed or modified products, processes, or materials for packaging/labeling.

Job Responsibilities

This individual will be responsible for the design and coordination of packaging activities for New Products and Sustaining Operations.

This will include product package design, product labels, DFUs (Directions for Use), packaging specifications.

Creation, change, and control of all labeling and packaging components to support R&D in the plant.

Ensure all labeling and packaging components meet performance and healthcare standards, including conformance to all country-specific requirements.

Liaise with vendors on specifications for package and label components.

Communicate to teams and management on the progress of labeling and packaging projects.

Liaise with sister divisions to ensure a consistent approach to labeling and packaging.

Communicate with various departments within BSC on packaging-related projects.

Build quality into all aspects of work by maintaining compliance with all quality requirements.

Liaise with various translation companies for the translation of text used in all labeling and packaging components.

Job Requirements

Candidate requires at least a bachelor's degree in Engineering, Science, or Technology.

At least 3 to 5 years’ experience in a similar role.

Project management experience is strongly preferred.

Exceptional communication, facilitation, interpersonal, and relationship-building skills.

Ability to clearly communicate complex information across multiple functions, create buy-in from team members, and negotiate disagreements productively.

Strong knowledge of package and label components.

Extremely detail-oriented.

About Us

As a global medical technology leader for more than 40 years, our mission at Boston Scientific (NYSE: BSX) is to transform lives through innovative medical solutions that improve the health of patients. If you’re looking to truly make a difference to people both around the world and around the corner, there’s no better place to make it happen.

#J-18808-Ljbffr

Press Tab to Move to Skip to Content Link Select how often (in days) to receive an alert: Create Alert The primary mission for the Engineer II, Packaging is to assist in the development and analysis of packaging/labeling products and materials. Under direct supervision/guidance, compiles, analyzes, and reports operational, test, and research data to establish performance standards for newly designed or modified products, processes, or materials for packaging/labelling. Job Responsibilities: This individual will be responsible for the design and coordination of packaging activities for New Products and Sustaining Operations. This includes product package design, product labels, DFUs (Directions for Use), and packaging specifications. Creation, change, and control of all labeling and packaging components to support R&D in the plant. Ensure all labeling and packaging components meet performance and healthcare standards, including conformance to all country-specific requirements. Liaise with vendors on specifications for package and label components. Communicate to teams and management on the progress of labeling and packaging projects. Liaise with sister divisions to ensure a consistent approach to labeling and packaging. Coordinate with various departments within BSC on packaging-related projects. Build quality into all aspects of work by maintaining compliance with all quality requirements. Liaise with various translation companies for the translation of text used in all labeling and packaging components. Job Requirements: Bachelor's degree in Engineering, Science, or Technology is required. At least 3 to 5 years of experience in a similar role. Project management experience is strongly preferred. Exceptional communication, facilitation, interpersonal, and relationship-building skills. Ability to clearly communicate complex information across multiple functions, create buy-in from team members, and negotiate disagreements productively. Strong knowledge of package and label components. Extremely detail-oriented. About Us: As a global medical technology leader for more than 40 years, our mission at Boston Scientific (NYSE: BSX) is to transform lives through innovative medical solutions that improve patient health. If you’re looking to truly make a difference to people around the world and nearby, there’s no better place to do it.

Job Segment:

Package Design, Project Manager, Engineer, Medical Technology, Manufacturing, Technology, Engineering, Research, Healthcare

#J-18808-Ljbffr

Job Description

Change the world. Love your job. Interface across various work areas and organizations to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power. In this role you'll get the opportunity to thrive in a fast paced, dynamic environment where high-energy, prioritization skills and adaptability are a must!

Packaging engineers play an important role at TI which encompasses the following responsibilities: Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages. Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.

As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry's top engineering minds at your disposal. TI's corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy.

Put your talent to work with us as a Packaging Engineer ! Qualifications

Bachelor's degree in Mechanical Engineering, Mechatronic Engineering, Physics, Software Engineering, Computer Science and other relevant backgrounds Cumulative 3.0/4.0 GPA, or higher Fresh graduates to less than 2 years of relevant working experiences Preferred Qualifications: Basic understanding of statistical process control (SPC) Semiconductor packaging knowledge is preferred (manufacturing processes, assembly, reliability, materials, characterization, FA) Proficient in AutoCAD and SolidWorks Skilled in programming language such as Phyton is preferred Exposure to AI/ML will be added advantage Demonstrated analytical and problem-solving skills Strong written and verbal communication skills Ability to work in teams and collaborate effectively with people in different functions Strong time management skills that enable on-time project delivery Ability to build strong, influential relationships Ability to work effectively in a fast-paced and rapidly changing environment Ability to take the initiative and drive for results Texas Instruments will not sponsor job applicants for visas or work authorization for this position. About Us

Why TI? Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.Meet the people of TI Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more atTI.com . Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. If you are interested in this position, please apply to this requisition. TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment. Job Info

Job Identification 25000761 Job Category Engineering - Product Dev Posting Date 08/21/2025, 01:47 AM Apply Before 08/30/2025, 04:00 PM Degree Level Bachelor's Degree Locations MELA Batu Berendam Free Trade Zone, Melaka, 75350, MY ECL/GTC Required Yes Texas Instruments is an equal opportunity employer. Click here to learn more and for information on accessibility and your rights as an applicant. If you have an inquiry about opportunities to partner with TI to support workforce development, email

#J-18808-Ljbffr

Job Description

Change the world. Love your job. Interface across various work areas and organizations to help with the design, development and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power. In this role you'll get the opportunity to thrive in a fast paced, dynamic environment where high-energy, prioritization skills and adaptability are a must!

Packaging engineers play an important role at TI which encompasses the following responsibilities: Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages. Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.

As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industry's top engineering minds at your disposal. TI's corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect, dignity, kindness and courtesy.

Put your talent to work with us as a Packaging Engineer ! Qualifications

Bachelor's degree in Mechanical Engineering, Mechatronic Engineering, Physics, Software Engineering, Computer Science and other relevant backgrounds Cumulative 3.0/4.0 GPA, or higher Fresh graduates to less than 2 years of relevant working experiences Preferred Qualifications: Basic understanding of statistical process control (SPC) Semiconductor packaging knowledge is preferred (manufacturing processes, assembly, reliability, materials, characterization, FA) Proficient in AutoCAD and SolidWorks Skilled in programming language such as Phyton is preferred Exposure to AI/ML will be added advantage Demonstrated analytical and problem-solving skills Strong written and verbal communication skills Ability to work in teams and collaborate effectively with people in different functions Strong time management skills that enable on-time project delivery Ability to build strong, influential relationships Ability to work effectively in a fast-paced and rapidly changing environment Ability to take the initiative and drive for results Texas Instruments will not sponsor job applicants for visas or work authorization for this position. About Us

Why TI? Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.Meet the people of TI Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more atTI.com . Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. If you are interested in this position, please apply to this requisition. TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment. Job Info

Job Identification 25000761 Job Category Engineering - Product Dev Posting Date 08/21/2025, 01:47 AM Apply Before 08/30/2025, 04:00 PM Degree Level Bachelor's Degree Locations MELA Batu Berendam Free Trade Zone, Melaka, 75350, MY ECL/GTC Required Yes Texas Instruments is an equal opportunity employer. Click here to learn more and for information on accessibility and your rights as an applicant. If you have an inquiry about opportunities to partner with TI to support workforce development, email

#J-18808-Ljbffr