What Jobs are available for Packaging Engineer in Malaysia?

**Company Description**
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and tomorrow's next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we're living in and that we have the power to shape.
Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.
Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.
**Job Description**
ESSENTIAL DUTIES AND RESPONSIBILITIES:
As a Packaging Engineer, you will work in the Packaging R&D group on the modeling and simulation, design of experiment and testing across semiconductor packaging, flash memory product and host levels.
+ Responsible for influencing package and product design by addressing the structural integrity and reliability issues in particular and advancing the technology of semiconductor packaging in general. The scope is to address all mechanical aspects of packaging technology and associated material and process interactions. The focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects, higher power, and higher reliability.
+ Responsible for the modeling and simulation, design of experiment, and testing, whichever comes first for best engineering practice, of mechanical responses of IC package and flash products including solid state drives.
+ This position will interface with package & product design, electrical and physical characterization, reliability testing, failure analysis, assembly R&D and other process teams.
+ Solid background in applied mechanics, especially computational and/or experimental solid mechanics, is required. In-depth knowledge of IC packaging is highly desired.
**Qualifications**
REQUIRED:
+ Ph.D. in Mechanical Engineering plus >1 year, or M.S. in Mechanical Engineering plus >3 years, or B.S. in Mechanical Engineering plus 5 years of relevant industrial experience.
+ Solid knowledge through academic coursework or experience required in mechanical engineering of IC packaging and related areas.
+ Strong background in computational solid mechanics and/or experimental solid mechanics with emphasis on failure analysis and design of experiment.
+ Broad knowledge of mechanical behaviors of various material types, including composite laminates, polymers, and metals (e.g., solder).
+ Working knowledge in designing and conducting mechanical testing and/or using a commercial FEA package.
+ Good understanding of general semiconductor packaging processes, materials, technology and trends, such as substrate design and manufacturing, molding, wire-bonding, die attach, flip chip, etc.
SKILLS:
+ Strong oral and written communication skills.
+ Demonstrated strong work ethic.
+ Ability to work in a global team environment and interact with other engineers to define and implement experiments and conduct relevant simulation for feasibility and validation of concepts and provide design solutions to support new package technology development.
**Additional Information**
Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.
Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at ( ) to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.
**NOTICE TO CANDIDATES:** Sandisk has received reports of scams where a payment is requested on Sandisk's behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline ( or email

**Company Description**
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and tomorrow's next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we're living in and that we have the power to shape.
Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.
Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.
**Job Description**
Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets (Process Module Engineering) supporting New Product Introduction/Qualification from Development to High volume manufacturing.
ESSENTIAL DUTIES AND RESPONSIBILITIES:
+ New Die Prep (Wafer Backgrinding, Sawing, Laser Dicing, Stealth Laser Dicing) Process Development for new wafer technology, next generation products, new material qualifications, new machine qualifications and new process qualifications.
+ Setup new recipe for Die Prep processes (Back-grinding, mounting, laser groove, mechanical dicing, tape & reel), perform complete window study, DOEs, corner limits.
+ Golden recipe setup for new package qualification.
+ Process Qualification to meet process Critical to Quality Requirements, CPK, Full risk assessment, UPH, Yield, and Cost targets.
+ Process transfer from Development to New product Introduction team & from site to site.
+ Work closely with Cross site's Product development & design team to understand the Package Design Rules & Requirements.
+ Strong Problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology.
**Qualifications**
REQUIRED:
+ Min Bachelor or higher Engineering degree (Electrical Engineering, Mechanical Engineering, & etc)
+ Min 2 years of working experience in Semiconductor Process development
+ Process engineering/ NPI engineering background
+ Knowledge in Semiconductor assembly processes
PREFERRED:
+ Min 4 years of working experience in Semiconductor Process development
+ Process engineering/ NPI engineering background with either one of the processes below: wafer thinning/ backgrinding, Mechanical dicing, laser dicing/ laser grooving, wafer inspection/ Automatic optical inspection, stealth dicing
+ Innovative, have patent disclosure will be an added advantage.
+ Knowledge in Artificial Intelligent and machine learning, an added advantage
+ Experience in Process transfer from Development to New product Introduction team & from site to site
SKILLS:
+ Strong Problem-solving skills and good Root Cause Analysis/Finding using 5M + 1E, 5 whys, DMAIC, 8D approach/methodology
+ Knowledge of Design Of Experiment (DOE)
+ Familiarize with Failure Mode Effects Analysis (FMEA), Statistical Process Control (SPC), 8D Problem Solving, 6 Sigma certification, Minitab, JMP
+ Good project planning, strong sense of quality and urgency
+ Team leads with good communication and interpersonal skills.
**Additional Information**
Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.
Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at ( ) to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.
**NOTICE TO CANDIDATES:** Sandisk has received reports of scams where a payment is requested on Sandisk's behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline ( or email

**Company Description**
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and tomorrow's next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we're living in and that we have the power to shape.
Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.
Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.
**Job Description**
**ESSENTIAL DUTIES AND RESPONSIBILITIES:**
+ Conduct comprehensive commonality analyses across product design, processes, machinery, materials, and measurement methodologies. Facilitate cross-functional collaboration to execute Root Cause Corrective Action (RCCA) initiatives with maximum efficacy.
+ Design and implement rigorous engineering Design of Experiments (DOEs) and apply advanced statistical analysis methods for complex problem-solving and data-driven decision-making processes.
+ Execute thorough factory Design for Mechanical Assembly and Automation (DFMA) evaluations for Solid-State Drive (SSD) assembly through meticulous examination of Design Packages, including design concepts, tolerance stack-up analyses, and Design Failure Mode and Effects Analysis (DFMEA). Actively participate in the design of machines and fixtures to enable optimal process performance.
+ Design SSD (Solid-State Drive) assembly jigs / fixtures by developing new concepts, performing reverse engineering, and creating mechanical drawings to support daily mechanical assembly and technical staging activities.
+ Oversee the development and implementation of comprehensive Product Qualification Packages during the development phase, encompassing product specifications, packaging requirements, mechanical drawings, supplier Design for Manufacturability (DFM) guidelines, and Quality Management Plans (QMP) for each qualified product.
+ Spearhead specialized engineering characterization activities, lead strategic cost reduction projects, and provide critical support for factory emergency taskforce operations as required.
**Qualifications**
REQUIRED:
+ Bachelor's Degree in Mechanical Engineering or related disciplines is mandatory. Academic studies must be in an applicable field of engineering or science, demonstrating a record of scholastic excellence.
+ Recent graduates with exceptional academic credentials will be considered.
+ Candidates with 3-5 years of professional experience in an engineering role within the semiconductor and automation industry will be given preferential consideration.
+ Proven ability to swiftly analyze and resolve complex engineering challenges through innovative approaches, demonstrating a clear understanding of efficiency and resource optimization.
+ Exceptional skill in synthesizing and presenting complex design concepts and data sets to both technical and non-technical audiences, with particular expertise in designing and executing Design of Experiments (DOE).
+ Exceptional verbal and written communication skills are essential for success in this role.
PREFERRED:
+ Comprehensive understanding of common mechanical commodities used in the semiconductor industry, including metals, plastics, rubbers, and adhesives is highly desirable.
+ In-depth knowledge of manufacturing processes and tooling construction for mechanical commodities, including but not limited to CNC milling, stamping, bending, injection molding, die casting, and extrusion, will be viewed favorably.
+ Superior self-motivation and self-direction, coupled with a demonstrated capacity for effective teamwork and strong intercultural competence.
SKILLS:
+ Advanced proficiency in quality management tools (FMEA, 8D, DMAIC) and statistical analysis software (JMP, Minitab).
+ Expert-level proficiency in SolidWorks CAD software is required. Familiarity with SolidWorks Flow Simulation is a significant advantage.
+ Extensive hands-on experience with technical equipment and processes, including advanced metrology and failure analysis techniques.
**Additional Information**
Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.
Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at ( ) to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.
**NOTICE TO CANDIDATES:** Sandisk has received reports of scams where a payment is requested on Sandisk's behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline ( or email

**Change the world. Love your job.**
**About TI**
As a global semiconductor company, we design, manufacture, test and sell analog and embedded processing chips to nearly 100,000 customers. Our products enable electronics everywhere and in things you experience every day - from health care, smart homes and connected cars to drones, smart phones and more. Our passion to create a better and more sustainable world by making electronics more affordable through semiconductors drives us to make our technology smaller, more efficient, more reliable and more affordable
**About TI Internship Program & Roles**
Texas Instruments (TI) offers a **structured internship program** designed to provide real-world, hands-on engineering experience while supporting your learning and development
As an Engineering Intern, you'll work alongside experienced engineers and contribute to **meaningful projects that make an impact** , **challenging, and provide an educational experience** for the student while they contribute to the success of TI. Exact intern projects are determined at the beginning of the work term based on current priorities and the strengths of the selected student. Available Internship roles include
**Equipment Engineer Intern**
**Key Responsibilities:**
+ Involved in evaluating, selecting, and supporting the installation and maintenance of manufacturing equipment. You'll assist in monitoring equipment performance and reliability, identifying opportunities to improve uptime, and implementing preventive maintenance schedules. This role also includes providing technical support to repair teams and collaborating with process engineering to resolve equipment-related issues, all while following standard procedures and safety protocols in a fast-paced manufacturing environment.
**Process Engineer Intern**
**Key Responsibilities:**
+ The role involves process simplification and optimization to improve quality and productivity, with including ensuring outgoing quality, managing lot disposition and yield improvement, and maintaining process flows and documentation. The individual will also analyze defects, collaborate with engineering teams to perform root cause analysis, and implement corrective actions to ensure effective quality control and continuous improvement.
**Manufacturing Operation Intern**
**Key Responsibilities:**
+ Support manufacturing operations by compiling and evaluating test data, driving continuous improvement initiatives, reducing human error scrap, and implementing 5S in a start-up environment. You'll also participate in cross-functional teams to solve technical and process issues, optimize area layouts, and work toward improving audit scores and overall productivity in a highly automated factory setting.
**Quality Engineer Intern (QA/CGE/FAE)**
**Key Responsibilities:**
+ Quality Assurance (QA) Engineering Intern: Managing local audit programs; verify conformance of manufactured IC devices and process materials to relevant TI and customer specifications
+ Failure Analysis Engineering (FAE) Intern: Perform failure analysis on products to determine the root cause of failure; work in cross-functional teams to resolve analysis issues; provide progress reports of analysis as well as a final written report of analysis and findings; and meet cycle time and success rate metrics established for customer satisfaction and quality team success.
+ Customer Quality Engineering (CQE) Intern - Manage customer returns and use TI tools to provide frequent status updates to affected customers; work effectively with test, design, product and planning engineers, regional quality engineers, regional planners, regional technical sales representatives and marketing representatives to solve customer challenges and provide answers.
**Product/Test Engineer Intern**
**Key Responsibilities:**
+ Support the development and implementation of strategies that achieve profitability targets on assigned TI product lines through new product development, cost reduction, capacity expansion and yield enhancement projects. You'll have direct involvement in the entire lifecycle of the products in your assigned within the product portfolio, including product definition, qualification, manufacturing, cost optimization, and quality
**Packaging Engineer Intern**
**Key Responsibilities:**
+ Support cross-functional teams in planning, coordinating, and executing engineering and manufacturing projects. You'll assist in tracking project timelines, managing deliverables, preparing reports, and identifying risks to ensure smooth execution. This role offers exposure to real-world project management practices in a high-tech environment, helping you build skills in communication, organization, and stakeholder coordination.
**Facilities Engineering Intern**
**Key Responsibilities:**
+ Work on challenging projects related to their field of study, such as Mechanical, Chemical, or Electrical Engineering, to support advanced micro-electronics manufacturing operations. Interns will analyze and improve existing systems, automate facilities systems, and conduct feasibility studies, among other responsibilities, to gain hands-on experience and contribute to the facilities organization.
**Project Management Engineer Intern**
**Key Responsibilities:**
+ Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.
Texas Instruments will not sponsor job applicants for visas or work authorization for this position.
**Why TI?**
+ Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
+ We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI ( Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
**About Texas Instruments**
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com .
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
If you are interested in this position, please apply to this requisition.
**Location (Malaysia:**
+ Batu Berendam, Malacca
+ Kuala Lumpur
**Minimum requirements:**
+ Currently pursuing a **Bachelors** in Electrical & Electronics (E&E), Mechanical, Mechatronic, Chemical, Physics and relevant engineering fields
+ Cumulative 3.3/4.0 GPA or higher
+ **Location:** Texas Instruments Malaysia, Kuala Lumpur (Onsite)
+ **Note:** Please attach your university internship form (if applicable) and include your internship start and end dates in your resume when submitting your application
+ I **nternship Period:** Start in Year 2026 (Following University Academic Requirements )
**Preferred Skills**
- Programming: C, C++, Python, Visual Basic
- Tools: AutoCAD, MATLAB, LabVIEW, JMP, Excel macros
- Exposure to ATE, debug, hardware interfacing, or automation is a plus
**Preferred qualifications:**
+ Programming: C, C++, Python, Visual Basic
+ Tools: AutoCAD, MATLAB, LabVIEW, JMP, Excel macros
+ Exposure to ATE, debug, hardware interfacing, or automation is a plus (throigh assignment, projects, competition & FYP)
+ Ability to establish strong relationships with key stakeholders critical to success, both internally and externally
+ Strong verbal and written communication skills
+ Ability to quickly ramp on new systems and processes
+ Demonstrated strong interpersonal, analytical and problem-solving skills
+ Ability to work in teams and collaborate effectively with people in different functions
+ Ability to take the initiative and drive for results
+ Strong time management skills that enable on-time project delivery
**ECL/GTC Required:** Yes