15 Die Saw jobs in Malaysia
Engineer Maintenance Die Attach
Posted 11 days ago
Job Viewed
Job Description
Lead FOL (DA) planned maintenance teams groups in DA Assy to execute equipment scheduled maintenance timely and comprehensively.
Job Description
In your new role you will:
- Establish and/or modify planned maintenance guide to ensure all equipment have reliable machine uptime.
- Train the technical team in define competency model and follow through on the technical level certification.
- Maintenance: Manage DA assembly equipment maintenance systematic, actual maintenance activities and the maintenance personnel in order to achieve best equipment efficiency and maintenance cost.
- Coordinate all Safety, Health and Environment activities.
- Coordinate and align the deployment of policy and strategy in planned Maintenance.
- Maintenance Job Card.
Your Profile
You are best equipped for this task if you have:
- Masters/Bachelor’s Degree in Engineering (Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology).
- More than3 years working experience in electronics or semiconductor manufacturing industry.
- Good communications and interpersonal skills.
- Good understanding of TPM and Maintenance systematics.
- Capable to trouble-shooting machine issues and drive for improvement.
- Good understanding of machine mechanism and capable to perform PM activities.
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Die Attach Equipment Technician
Posted 11 days ago
Job Viewed
Job Description
Experience Die Attach Equipment Technician capable to work independently to maintain and repair Die Attach integrated line which includes loader, unloader, die attach, AOI, and reflow oven equipment. Die Attach Equipment Technician must have experience working in semiconductor assembly equipment, strong troubleshooting skills, and equipment knowledge to ensure all equipment performance is always in tip-top condition to meet department OEE and MTBA/MTBF goals.
Responsibilities:
- Die Attach Equipment Technician specialist with vast experience working on Die Attach equipment such as Datacon 8800 FC QUANTUM is a must; preferable to also have experience on Hanwha Die Attach equipment.
- Maintain and repair Die Attach integrated line which includes loader, unloader, die attach, AOI, and reflow oven equipment.
- Perform equipment setup or conversion for any product changes for Die Attach integrated line which includes loader, unloader, die attach, AOI, and reflow oven equipment.
- Work independently to identify, sustain, purchase, and find second sources for Die Attach integrated critical spare parts and tooling.
- Maintain/sustain equipment performance to meet defined goals.
- Improve FC Overall OEE, MTBA/MTBF, PM Effectiveness, and Unscheduled Downtime.
- Maintain machine performance, address the problem root cause, and solve quality issues caused by the machine.
Compensation Details:
- Support production to meet weekly schedule targets through working either normal or shift hours when or where needed, especially on weekends and public holidays.
- Manage the maintenance activities of machines and fabrication of spare parts.
- Demonstrate good discipline and punctuality with minimal supervision.
Requirements:
- Diploma in Electrical & Electronics or Mechanical Engineering discipline, or certificate with a minimum of 5 years of relevant working experience in Die Attach equipment.
- Experience in semiconductor assembly and applied statistics will be an advantage.
- Good technical skills on Front and Back End assembly equipment.
- Strong interpersonal and communication skills.
- Good decision-making and problem-solving skills.
- Familiar with production environment and possesses process handling knowledge (Semiconductor).
- Must be disciplined and willing to work long hours and shifts.
- Adhere to NXP Total Quality Mindset and Safety Awareness.
- Adhere to NXP core values: Trust and Respect, Collaboration, Ownership, Expertise, Innovation, and Growth.
Engineer Maintenance Die Attach
Posted 11 days ago
Job Viewed
Job Description
Lead FOL (DA) planned maintenance teams groups in DA Assy to execute equipment scheduled maintenance timely and comprehensively.
Job DescriptionIn your new role you will:
- Establish and/or modify planned maintenance guide to ensure all equipment have reliable machine uptime.
- Train the technical team in defining competency models and follow through on technical level certification.
- Manage DA assembly equipment maintenance systematically, including actual maintenance activities and personnel, to achieve optimal equipment efficiency and maintenance cost.
- Coordinate all Safety, Health, and Environment activities.
- Coordinate and align the deployment of policy and strategy in planned maintenance.
- Develop and oversee Maintenance Job Cards.
You are best equipped for this task if you have:
- Masters/Bachelor’s Degree in Engineering (Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology).
- More than 3 years of working experience in electronics or semiconductor manufacturing industry.
- Good communication and interpersonal skills.
- Good understanding of TPM and maintenance systematic approaches.
- Ability to troubleshoot machine issues and drive improvements.
- Good understanding of machine mechanisms and capability to perform PM activities.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. We drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Join us in making life easier, safer, and greener.
Are you in?We are on a journey to create the best Infineon for everyone. We embrace diversity and inclusion, welcoming everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect, and tolerance, and we are committed to providing equal opportunities for all applicants and employees. Our recruitment decisions are based on experience and skills.
Please inform your recruiter if there are specific considerations to facilitate your participation in the interview process.
#J-18808-LjbffrProcess Engineer, Die Attach
Posted 11 days ago
Job Viewed
Job Description
Your Contribution
- Responsible to develop and optimize new manufacturing process in the area of automated glass wafer bonding, glass wafer stacking
- In charge to optimize automated pick & place and glue dispensing process
- Specify new equipment and drive equipment development together with equipment supplier
- Achieve process capability and stabilize with 6sigma methods
- In charge of the Process FMEA and Process Control Plan
- Set up documentations like Work Instructions
- Design experiments (DoE) and analyze results using statistical analysis software to enhance the process capabilities and process yield.
- Responsible for metrology equipment buy off at vendor site and at manufacturing site including all needed documentations.
- Accountable to identify and implement continuous improvement activities for efficiency gain and quality improvement
- 3-5 years experience in the field of process development within the semiconductor or optical industry ideally in the area of glass wafer stacking or glue or similar experience.
- BSc/MSC/PhD Degree in Mechatronics / Electronic Engineering / Photonics / Physics / Optics.
- Understanding of manufacturing processes in optical or semiconductor industry.
- Proficiency with data analysis, DOE, and statistical techniques.
- Excellent communication, organizational, and team building skills.
- Target driven personality with high execution focus
SCHOTT’s openness to promote your further development is just as great as our additional benefits. Ranging from active health management via flexible working hours and hybrid work all the way to corporate pension plans: everything geared to suit your goals and needs. Discover a special corporate culture where everyone has the opportunity to develop their entire potential.
At SCHOTT, you can expect a unique corporate culture where we emphasize equity, diversity, and inclusion. We know: motivated and committed employees are the precondition for the success of our company.
Please feel free to contact us
You can expect interesting tasks and challenging projects, as well as motivated and friendly teams in fields that influence our future. Do you want to be successful with us? Then, please send us your application: SCHOTT Glass (Malaysia) Sdn. Bhd., Human Resources, Wendy Wang, +86512680959896101
- At SCHOTT, it’s your personality that counts – not your gender, your identity, or origin.
Process Engineer, Die Attach
Posted 11 days ago
Job Viewed
Job Description
About us
Your Contribution- Responsible to develop and optimize new manufacturing process in the area of automated glass wafer bonding, glass wafer stacking
- In charge to optimize automated pick & place and glue dispensing process
- Specify new equipment and drive equipment development together with equipment supplier
- Achieve process capability and stabilize with 6sigma methods
- In charge of the Process FMEA and Process Control Plan
- Set up documentations like Work Instructions
- Design experiments (DoE) and analyze results using statistical analysis software to enhance the process capabilities and process yield.
- Responsible for metrology equipment buy off at vendor site and at manufacturing site including all needed documentations.
- Accountable to identify and implement continuous improvement activities for efficiency gain and quality improvement
- 3-5 years experience in the field of process development within the semiconductor or optical industry ideally in the area of glass wafer stacking or glue or similar experience.
- BSc/MSC/PhD Degree in Mechatronics / Electronic Engineering / Photonics/ Physics / Optics.
- Understanding of manufacturing processes in optical or semiconductor industry.
- Proficiency with data analysis, DOE, and statistical techniques.
- Excellent communication, organizational, and team building skills.
- Target driven personality with high execution focus
SCHOTT’s openness to promote your further development is just as great as our additional benefits. Ranging from active health management via flexible working hours and hybrid work all the way to corporate pension plans: everything geared to suit your goals and needs. Discover a special corporate culture where everyone has the opportunity to develop their entire potential.
At SCHOTT, you can expect a unique corporate culture where we emphasize equity, diversity, and inclusion. We know: motivated and committed employees are the precondition for the success of our company.
Please feel free to contact us. You can expect interesting tasks and challenging projects, as well as motivated and friendly teams in fields that influence our future. Do you want to be successful with us? Then, please send us your application: SCHOTT Glass (Malaysia) Sdn. Bhd., Human Resources, Wendy Wang, +86512680959896101
*At SCHOTT, it’s your personality that counts – not your gender, your identity, or origin.
#J-18808-LjbffrProcess Engineer, Die Attach
Posted today
Job Viewed
Job Description
Responsible to develop and optimize new manufacturing process in the area of automated glass wafer bonding, glass wafer stacking In charge to optimize automated pick & place and glue dispensing process Specify new equipment and drive equipment development together with equipment supplier Achieve process capability and stabilize with 6sigma methods In charge of the Process FMEA and Process Control Plan Set up documentations like Work Instructions Design experiments (DoE) and analyze results using statistical analysis software to enhance the process capabilities and process yield. Responsible for metrology equipment buy off at vendor site and at manufacturing site including all needed documentations. Accountable to identify and implement continuous improvement activities for efficiency gain and quality improvement Your Profile
3-5 years experience in the field of process development within the semiconductor or optical industry ideally in the area of glass wafer stacking or glue or similar experience. BSc/MSC/PhD Degree in Mechatronics / Electronic Engineering / Photonics/ Physics / Optics. Understanding of manufacturing processes in optical or semiconductor industry. Proficiency with data analysis, DOE, and statistical techniques. Excellent communication, organizational, and team building skills. Target driven personality with high execution focus Your Benefits
SCHOTT’s openness to promote your further development is just as great as our additional benefits. Ranging from active health management via flexible working hours and hybrid work all the way to corporate pension plans: everything geared to suit your goals and needs. Discover a special corporate culture where everyone has the opportunity to develop their entire potential. At SCHOTT, you can expect a unique corporate culture where we emphasize equity, diversity, and inclusion. We know: motivated and committed employees are the precondition for the success of our company. Please feel free to contact us. You can expect interesting tasks and challenging projects, as well as motivated and friendly teams in fields that influence our future. Do you want to be successful with us? Then, please send us your application: SCHOTT Glass (Malaysia) Sdn. Bhd., Human Resources, Wendy Wang, +86512680959896101 *At SCHOTT, it’s your personality that counts – not your gender, your identity, or origin.
#J-18808-Ljbffr
Die Attach Equipment Technician
Posted today
Job Viewed
Job Description
#J-18808-Ljbffr
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Staff Engineer Maintenance Die Attach
Posted 11 days ago
Job Viewed
Job Description
Support to optimize machine performance and efficiency by using adequate problem solving tools available.
Job DescriptionIn your new role you will:
- Manage spare parts usage, control budgets, and work on cost reductions.
- Troubleshoot and diagnose difficult, infrequent problems systematically.
- Monitor PM activities, OEE & MTBA performance, quality, and yield of assembly processes.
- Support production stabilization projects to achieve robust manufacturing.
- Assist in monitoring, improving, analyzing, and controlling processes, materials, tooling, and equipment; update relevant documents.
- Support new product and equipment ramp-up and expansion of manufacturing lines.
You are best equipped for this task if you have:
- Masters/Bachelor’s Degree in Engineering (Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology).
- More than 5 years of working experience in electronics or semiconductor manufacturing industry.
- Good communication and interpersonal skills.
- Ability to coach and supervise technical specialists/technicians by assigning tasks and checking work regularly.
- Good understanding of TPM and maintenance systems.
- Strong analytical and problem-solving skills.
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions for power systems and IoT, Infineon enables innovative solutions for green energy, clean mobility, and smart IoT. We drive innovation and customer success, caring for our people and empowering them to reach ambitious goals. Join us in making life easier, safer, and greener.
Are you in?
We aim to create the best Infineon for everyone. We embrace diversity and inclusion, welcoming everyone for who they are. Our work environment is based on trust, openness, respect, and tolerance. We are committed to equal opportunities for all applicants and employees. Recruitment decisions are based on experience and skills. Please inform your recruiter if you need accommodations during the interview process.
#J-18808-LjbffrSenior Engineer Equipment Engineering Die Attach
Posted 11 days ago
Job Viewed
Job Description
To drive Die Bond/SMT planned maintenance systematic & methodology to ensure machine performance at the optimum condition. Execute equipment improvement and governance.
Job Description
In your new role you will:
- Drive and build planned maintenance definition with high availability, good reliability and appropriate quality performance.
- Lead the planned maintenance teams and maintenance technician groups to execute equipment scheduled maintenance timely and comprehensively and define the parts life span and consumption.
- Advanced Process Control Key numbers definition, pilot, implement, cascading at equipment platform
- Manage maintenance cost in sustaining the equipment to it fullest performance.
- Develop and execute EQ governance business process/framework.
- Drive a culture based of equipment improvement on maintenance routines and engineering solutions using training, systematic troubleshooting and root cause corrective actions.
Your Profile
You are best equipped for this task if you have:
- Masters/Bachelor’s Degree in Engineering (Mechanical / Electrical/Electronics / Microelectronics / Mechatronics / Semiconductor Technology) or equivalent.
- Knowledge in Die Bond process, SMT process will be plus point.
- Possess a broad background in mechanical engineering / manufacturing with a wide range of knowledge on manufacturing and production processes.
- Familiar with the latest equipment / technology in the industry and able to upgrade/ improve existing equipment to suit the business needs
- Familiar with SMT equipment.
- Ability to build a high performance team who can operate efficiently, effectively, productively and cost effectively.
#WeAreIn for driving decarbonization and digitalization.
As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
Are you in?
We are on a journey to create the best Infineon for everyone.
This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.Learn more about our various contact channels.
Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.
Senior Engineer (Die Attach), Packaging Engineering

Posted 12 days ago
Job Viewed
Job Description
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today's needs and tomorrow's next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we're living in and that we have the power to shape.
Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.
Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.
**Job Description**
**ESSENTIAL DUTIES AND RESPONSIBILITIES:**
+ Responsible for Die Attach Process Recipe / Process Parameters setup.
+ Setup new Die Attach processes, recipe, perform complete window study, DOEs, corner limits.
+ Process Qualification to meet process Critical to Quality Requirements, CPK, Full risk assessment, UPH, Yield, and Cost targets.
+ Work closely with Cross site's Product development & design team to understand the Package Design Rules & Requirements.
+ New process development for new wafer technology, next generation products, new material / machine / tooling / software qualifications. Define Leading edge Die Attach Technology Roadmap / building block.
+ Ensure effective handshake / pass over of process for New device / product introduction to the High Volume Manufacturing.
+ Support new material (DAF) and tools (rubber tip / ejector) qualification.
+ Strong problem-solving skills and good Root Cause Analysis / Finding using 5M + 1E, 5 whys, DMAIC, 8D approach / methodology.
+ Knowledgeable in production control processes, SPC, Data Analysis / Interpretation GR&R, Cp/Cpk and correlation analysis, MSA.
+ Report any non-conformance / customer complaint issue and develop / follow up the improvement actions.
+ Documentation: SOP, WI, FMEA, OCAP and Control Plan for related process.
**Qualifications**
**REQUIRED:**
+ Bachelor or higher Engineering degree in Mechanical / Mechatronics / Electronics / Physics & etc.
+ Specialization or coursework in AI / ML / Data Science will be added advantages.
+ More than 3 years of hand-on experience in Die Attach process development preferred.
**SKILLS:**
+ Hand-on experience in Renesas / Fasford / Canon die bonder is a plus point.
+ Proficiency in data analytics & strong problem-solving with statistical analysis skills (DOE, SPC, and AI-driven methodologies).
+ Self- motivated, possess initiatives and ability to lead and work independently.
+ Good project planning, strong sense of quality and urgency.
+ Team player with good communication and interpersonal skills.
**Additional Information**
Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.
Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at ( ) to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.
**NOTICE TO CANDIDATES:** Sandisk has received reports of scams where a payment is requested on Sandisk's behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline ( or email